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| 6 C innovator in electronics c-29-c www.murata.com gjm series: the murata gjm series is a high q, ultra-small capacitor series for high frequency applications in the 500mhz to 10ghz range. they are suitable for applications such as vco and pa modules. the gjm series is made with copper electrodes as a cost effective solution for low esr and power consumption due to the high q (low loss) performance. a variety of tight tolerance versions are available, offered in eia sizes 0201 and 0402 with a capacitance range of 0.1 to 33pf. features: size: 0201, 0402 voltage: 6.3, 25 and 50vdc cap range: 0.1 - 20pf 25 - 50vdc and 22 - 33pf in 6.3vdc internal electrode: cu termination: cu + ni/sn plating esr: very low power: low (<=5w) frequency range: 500mhz -10ghz, high q and low esr at vhf, uhf and microwave frequencies tolerance: tight tolerance available ([w]=+/-0.05 pf for under 10pf, [b]=+/-0.1pf for under 10 pf, [c]=+/-0.25pf for under 10pf, [g]=+/-2% for 10pf and over temp. characteristics: c0g (0+/-30ppm/c-55 to 125c) and c0h (0+/-60ppm/c-55 to 125c) applications: handheld and cellular, bluetooth ? , vco, wlan, pa modules, wireless modems, rke, wireless pdas, antenna tuning and gps g j m series applica tion specific cap a citor s high frequency ceramic capacitors gjm product summary
innovator in electronics C 7 c-29-c www.murata.com indiv i dua l speci fi c atio n code p rodu ct i d s e ri e s dim en s i o n (lxw) dim en s i o n (t) t e m perat ur e c hara ct e r i sti c s rated vo ltag e c a paci t a n c e c apaci tance tol er a n c e p ack a gi ng code pr o duc t g j hig h f r equenc y low loss type code dim e n s ion ( l x w ) 0 3 0 . 6 x 0 . 3 m m 1 5 1 . 0 x 0 . 5 m m cod e d i m e n s ion ( t ) 3 0 . 3 m m 5 0 . 5 m m cod e capac i t anc e r 1 0 0 . 1pf 1 r 0 1pf 100 10pf code rat ed v o l t age 0j dc 6.3v 1 h dc 50v c o d e t c t e m p . c o e f f i c i e nt operating t e m p . rang e 5 c c 0 g 0 + / - 3 0 p p m /c - 5 5 to 1 2 5c 6 c c 0 h 0 + / - 6 0 p p m /c - 5 5 to 1 2 5c c o d e c a p . t o l . t c w + / - 0 . 0 5 p f c 0 g, c0 h ( u n der 1 0 p f ) b + / - 0 . 1 p f c0g , c 0 h ( u n der 1 0 p f ) c + / - 0 . 2 5 p f c0g , c 0 h ( u n der 1 0 p f ) d + / - 0 . 5 p f c 0 g , c 0 h ( 5 . 1 to 9 . 1 p f ) f + / - 1 % c0g , c 0h ( 1 0 p f & o v e r ) g + / - 2 % c0g , c 0h ( 1 0 p f & o v e r ) j + / - 5 % c0g , c 0h ( 1 0 p f & o v e r ) 1 e dc 25v 1 h dc 50v d + / - 0 . 5 p f c 0 g , c 0 h ( 5 . 1pf - 9 . 9pf ) g + / - 2% c0g , c 0 h ( 1 0 p f & over) j + / - 5% c0g , c 0 h ( 1 0 p f & over) code p r oduc t m t i n p l a t ed t e r m inat ion c ode pa cka g ing b b u l k i n n y l o n b a g d f 1 80 mm p a per t a p ing high frequency / high q gjm series global part numbering gj m 03 3 5c 1e 1 r0 c b01 d ch ip dim en sio n s t ab le s er ie s e ia si z e l w t e g m in . g j m 03 02 01 0. 6+/- 0. 03 0. 3+/- 0. 03 0. 3+/- 0. 03 0. 1 to 0. 2 0. 2 g j m 15 04 02 1. 0+/- 0. 05 0. 5+/- 0. 05 0. 5+/- 0. 05 0. 15 to 0. 3 0. 4 re-flo w s o ld er in g s er ie s a b c g j m 03 0. 2 ~ 0. 3 0. 2 ~ 0. 35 0. 2 ~ 0. 4 g j m 15 0. 3 ~ 0. 5 0. 35 ~ 0. 45 0. 4 ~ 0. 6 ) t ( n o i s n e m i d : - 4 - ) w x l ( n o i s n e m i d : - 3 - s e i r e s : - 2 - d i t c u d o r p : - 1 - c ode p r odu c t c ode p r odu c t c ode d i m e n s i o n ( l xw) c ode d i m e n s i o n ( t ) g j hig h f r equen cy low loss t y p e m t i n p l a t e d t e rmi nat i o n 0 3 0 . 6 x 0 . 3 m m ( e i a : 0201) 3 0 . 3 m m 1 5 1 . 0 x 0 . 5 m m ( e i a : 0402) 5 0 . 5 m m -1 - -2 - -3 - -4 - -5 - -6 - -7 - -8 - -9 - -10- g j m 0 33 5 c 1 e 1 r0 c b 0 1 d - 5 -:t e m p e r a t u r e c h a r act e r i s t i c s - 6 -:r a t e d v o l t a g e - 7 -:c a p aci t a n c e - 8 -:c a p aci t a n c e tol e r a n c e c ode t c t e m p . r a nge c a p c h a nge c ode r a t e d v o l t a g e c ode c a p aci t a n c e c ode c a p . tol . t c 5 c c 0 g - 5 5 t o 125c 0 + / - 30ppm / c 1 a d c 10v r 1 0 0 . 1pf w + / - 0 . 05pf c 0 g ( 5pf & under ) 6 c c 0 h - 5 5 t o 125c 0 + / - 60ppm / c 1 c d c 16v 1 r 0 1pf b + / - 0 . 1pf c 0 g , c 0 h ( unde r 10pf ) 1 e d c 25v 100 10pf c + / - 0 . 25pf c 0 g , c 0 h ( under 10pf ) -9-:individual specification code -10-:packaging code packaging b bulk in nyron bag d ? 178mm paper taping mass production capacitance range unit: mm chip structure c hi p di m ensi ons i n n e r e l e c t r o d e ( c u ) s n n i c u c e r a m i c s l t e e g chip ca p a c it o r c b a la nd s o ld e r r e sist land pattern dimensions dielectric (ceramic) plating (sn) barrier (ni) termination (cu) inner electrode (cu) dielectric (ceramic) plating (sn) barrier (ni) termination (cu) inner electrode (cu) series tc wv capacitance range 1pf 10pf 100pf pf gjm03 c0g 25 0.2 - 6.8pf c0h 25 7 - 20pf c0g 6.3 22 - 33pf gjm15 c0g 50 0.1 - 20pf mass production applica tion specific cap a citor s high frequency ceramic capacitors gjm data sheet g j m series 8 C innovator in electronics c-29-c www.murata.com pr o d u ct o ffe r i n g g j m ser ies s i ze t c w v c a p c a p tol m u r a t a globa l p / n 0201 c 0 g 25v 0 . 2pf + / - 0 . 1pf g jm 0335c 1 e r 20bb01d 0201 c 0 g 25v 0 . 3pf + / - 0 . 1pf g jm 0335c 1 e r 30bb01d 0201 c 0 g 25v 0 . 4pf + / - 0 . 1pf g jm 0335c 1 e r 40bb01d 0201 c 0 g 25v 0 . 5pf + / - 0 . 1pf g jm 0335c 1 e r 50bb01d 0201 c 0 g 25v 0 . 6pf + / - 0 . 1pf g jm 0335c 1 e r 60bb01d 0201 c 0 g 25v 0 . 7pf + / - 0 . 1pf g jm 0335c 1 e r 70bb01d 0201 c 0 g 25v 0 . 8pf + / - 0 . 1pf g jm 0335c 1 e r 80bb01d 0201 c 0 g 25v 0 . 9pf + / - 0 . 1pf g jm 0335c 1 e r 90bb01d 0201 c 0 g 25v 1 . 0pf + / - 0 . 25pf g jm 0335 c 1 e 1 r 0 c b 01d 0201 c 0 g 25v 1 . 1pf + / - 0 . 25pf g jm 0335 c 1 e 1 r 1 c b 01d 0201 c 0 g 25v 1 . 2pf + / - 0 . 25pf g jm 0335 c 1 e 1 r 2 c b 01d 0201 c 0 g 25v 1 . 3pf + / - 0 . 25pf g jm 0335 c 1 e 1 r 3 c b 01d 0201 c 0 g 25v 1 . 5pf + / - 0 . 25pf g jm 0335 c 1 e 1 r 5 c b 01d 0201 c 0 g 25v 1 . 6pf + / - 0 . 25pf g jm 0335 c 1 e 1 r 6 c b 01d 0201 c 0 g 25v 1 . 8pf + / - 0 . 25pf g jm 0335 c 1 e 1 r 8 c b 01d 0201 c 0 g 25v 2 . 0pf + / - 0 . 25pf g jm 0335 c 1 e 2 r 0 c b 01d 0201 c 0 g 25v 2 . 2pf + / - 0 . 25pf g jm 0335 c 1 e 2 r 2 c b 01d 0201 c 0 g 25v 2 . 4pf + / - 0 . 25pf g jm 0335 c 1 e 2 r 4 c b 01d 0201 c 0 g 25v 2 . 7pf + / - 0 . 25pf g jm 0335 c 1 e 2 r 7 c b 01d 0201 c 0 g 25v 3 . 0pf + / - 0 . 25pf g jm 0335 c 1 e 3 r 0 c b 01d 0201 c 0 g 25v 3 . 3pf + / - 0 . 25pf g jm 0335 c 1 e 3 r 3 c b 01d 0201 c 0 g 25v 3 . 6pf + / - 0 . 25pf g jm 0335 c 1 e 3 r 6 c b 01d 0201 c 0 g 25v 3 . 9pf + / - 0 . 25pf g jm 0335 c 1 e 3 r 9 c b 01d 0201 c 0 g 25v 4 . 0pf + / - 0 . 25pf g jm 0335 c 1 e 4 r 0 c b 01d 0201 c 0 g 25v 4 . 3pf + / - 0 . 25pf g jm 0335 c 1 e 4 r 3 c b 01d 0201 c 0 g 25v 4 . 7pf + / - 0 . 25pf g jm 0335 c 1 e 4 r 7 c b 01d 0201 c 0 g 25v 5 . 0pf + / - 0 . 25pf g jm 0335 c 1 e 5 r 0 c b 01d 0201 c 0 g 25v 5 . 1pf + / - 0 . 5pf g jm 0335 c 1 e 5 r 1 d b 01d 0201 c 0 g 25v 5 . 6pf + / - 0 . 5pf g jm 0335 c 1 e 5 r 6 d b 01d 0201 c 0 g 25v 6 . 0pf + / - 0 . 5pf g jm 0335 c 1 e 6 r 0 d b 01d 0201 c 0 g 25v 6 . 2pf + / - 0 . 5pf g jm 0335 c 1 e 6 r 2 d b 01d 0201 c 0 g 25v 6 . 8pf + / - 0 . 5pf g jm 0335 c 1 e 6 r 8 d b 01d 0201 c 0 h 25v 7 . 0pf + / - 0 . 5pf g jm 0336c 1 e 7 r 0 d b 01d 0201 c 0 h 25v 7 . 5pf + / - 0 . 5pf g jm 0336c 1 e 7 r 5 d b 01d 0201 c 0 h 25v 8 . 0pf + / - 0 . 5pf g jm 0336c 1 e 8 r 0 d b 01d 0201 c 0 h 25v 8 . 2pf + / - 0 . 5pf g jm 0336c 1 e 8 r 2 d b 01d 0201 c 0 h 25v 9 . 0pf + / - 0 . 5pf g jm 0336c 1 e 9 r 0 d b 01d 0201 c 0 h 25v 9 . 1pf + / - 0 . 5pf g jm 0336c 1 e 9 r 1 d b 01d 0201 c 0 h 25v 10pf +/- 5 % g jm 0336c 1 e 100jb 01d 0201 c 0 h 25v 12pf +/- 5 % g jm 0336c 1 e 120jb 01d 0201 c 0 h 25v 15pf +/- 5 % g jm 0336c 1 e 150jb 01d 0201 c 0 h 25v 18pf +/- 5 % g jm 0336c 1 e 180jb 01d 0201 c 0 h 25v 20pf +/- 5 % g jm 0336c 1 e 200jb 01d 0201 c 0 g 6 .3v 22pf +/- 5 % g jm 0335 c 0 j220jb 01d 0201 c 0 g 6 .3v 27pf +/- 5 % g jm 0335 c 0 j270jb 01d 0201 c 0 g 6 .3v 33pf +/- 5 % g jm 0335 c 0 j330jb 01d h i g h f r equ e n c y ( 0201 si ze / c0 g ,coh) gjm03 series g j m series applica tion specific cap a citor s high frequency ceramic capacitors gjm product offering innovator in electronics C 9 c-29-c www.murata.com pr o d u ct o ffe r i n g s i ze t c w v c a p c a p tol m u r a t a globa l p / n 0402 c 0 g 50v 0 . 1pf + / - 0 . 1pf g jm 1555 c 1 hr10bb01d 0402 c 0 g 50v 0 . 2pf + / - 0 . 1pf g jm 1555 c 1 hr20bb01d 0402 c 0 g 50v 0 . 3pf + / - 0 . 1pf g jm 1555 c 1 hr30bb01d 0402 c 0 g 50v 0 . 4pf + / - 0 . 1pf g jm 1555 c 1 hr40bb01d 0402 c 0 g 50v 0 . 5pf + / - 0 . 1pf g jm 1555 c 1 hr50bb01d 0402 c 0 g 50v 0 . 6pf + / - 0 . 1pf g jm 1555 c 1 hr60bb01d 0402 c 0 g 50v 0 . 7pf + / - 0 . 1pf g jm 1555 c 1 hr70bb01d 0402 c 0 g 50v 0 . 8pf + / - 0 . 1pf g jm 1555 c 1 hr80bb01d 0402 c 0 g 50v 0 . 9pf + / - 0 . 1pf g jm 1555 c 1 hr90bb01d 0402 c 0 g 50v 1 . 0pf + / - 0 . 25pf g jm 1555c 1 h 1 r 0 c b 01d 0402 c 0 g 50v 1 . 1pf + / - 0 . 25pf g jm 1555c 1 h 1 r 1 c b 01d 0402 c 0 g 50v 1 . 2pf + / - 0 . 25pf g jm 1555c 1 h 1 r 2 c b 01d 0402 c 0 g 50v 1 . 3pf + / - 0 . 25pf g jm 1555c 1 h 1 r 3 c b 01d 0402 c 0 g 50v 1 . 5pf + / - 0 . 25pf g jm 1555c 1 h 1 r 5 c b 01d 0402 c 0 g 50v 1 . 6pf + / - 0 . 25pf g jm 1555c 1 h 1 r 6 c b 01d 0402 c 0 g 50v 1 . 8pf + / - 0 . 25pf g jm 1555c 1 h 1 r 8 c b 01d 0402 c 0 g 50v 2 . 0pf + / - 0 . 25pf g jm 1555c 1 h 2 r 0 c b 01d 0402 c 0 g 50v 2 . 2pf + / - 0 . 25pf g jm 1555c 1 h 2 r 2 c b 01d 0402 c 0 g 50v 2 . 4pf + / - 0 . 25pf g jm 1555c 1 h 2 r 4 c b 01d 0402 c 0 g 50v 2 . 7pf + / - 0 . 25pf g jm 1555c 1 h 2 r 7 c b 01d 0402 c 0 g 50v 3 . 0pf + / - 0 . 25pf g jm 1555c 1 h 3 r 0 c b 01d 0402 c 0 g 50v 3 . 3pf + / - 0 . 25pf g jm 1555c 1 h 3 r 3 c b 01d 0402 c 0 g 50v 3 . 6pf + / - 0 . 25pf g jm 1555c 1 h 3 r 6 c b 01d 0402 c 0 g 50v 3 . 9pf + / - 0 . 25pf g jm 1555c 1 h 3 r 9 c b 01d 0402 c 0 g 50v 4 . 0pf + / - 0 . 25pf g jm 1555c 1 h 4 r 0 c b 01d 0402 c 0 g 50v 4 . 3pf + / - 0 . 25pf g jm 1555c 1 h 4 r 3 c b 01d 0402 c 0 g 50v 4 . 7pf + / - 0 . 25pf g jm 1555c 1 h 4 r 7 c b 01d 0402 c 0 g 50v 5 . 0pf + / - 0 . 25pf g jm 1555c 1 h 5 r 0 c b 01d 0402 c 0 g 50v 5 . 1pf + / - 0 . 5pf g jm 1555 c 1 h 5 r 1 d b 01d 0402 c 0 g 50v 5 . 6pf + / - 0 . 5pf g jm 1555 c 1 h 5 r 6 d b 01d 0402 c 0 g 50v 6 . 0pf + / - 0 . 5pf g jm 1555 c 1 h 6 r 0 d b 01d 0402 c 0 g 50v 6 . 2pf + / - 0 . 5pf g jm 1555 c 1 h 6 r 2 d b 01d 0402 c 0 g 50v 6 . 8pf + / - 0 . 5pf g jm 1555 c 1 h 6 r 8 d b 01d 0402 c 0 g 50v 7 . 0pf + / - 0 . 5pf g jm 1555 c 1 h 7 r 0 d b 01d 0402 c 0 g 50v 7 . 5pf + / - 0 . 5pf g jm 1555 c 1 h 7 r 5 d b 01d 0402 c 0 g 50v 8 . 0pf + / - 0 . 5pf g jm 1555 c 1 h 8 r 0 d b 01d 0402 c 0 g 50v 8 . 2pf + / - 0 . 5pf g jm 1555 c 1 h 8 r 2 d b 01d 0402 c 0 g 50v 9 . 0pf + / - 0 . 5pf g jm 1555 c 1 h 9 r 0 d b 01d 0402 c 0 g 50v 9 . 1pf + / - 0 . 5pf g jm 1555 c 1 h 9 r 1 d b 01d 0402 c 0 g 50v 10pf +/- 5 % g jm 1555c 1 h 100jb 01d 0402 c 0 g 50v 12pf +/- 5 % g jm 1555c 1 h 120jb 01d 0402 c 0 g 50v 15pf +/- 5 % g jm 1555c 1 h 150jb 01d 0402 c 0 g 50v 18pf +/- 5 % g jm 1555c 1 h 180jb 01d 0402 c 0 g 50v 20pf +/- 5 % g jm 1555c 1 h 200jb 01d h i g h f r equ e n c y ( 0402 si ze / c0 g ) gjm15 series g j m series applica tion specific cap a citor s high frequency ceramic capacitors gjm product offering 10 C innovator in electronics c-29-c www.murata.com specifications and test methods gjm series item specifications test methods operating temperature -55 oc to 125 oc reference temperature: 25 oc appearance no defects or abnormalities. visual inspection. dimension within the specified dimensions. using calipers. dielectric strength no defects or abnormalities. 300% of the rated voltage insulation resistance more than 10,000m or 500 f (whichever is smaller) dc voltage not exceeding the rated voltage at 25c and 75%rh max. and within 2 minutes of charging. q 30pfmin.: q r 1000 30pfmax.: q r 400+20c c: nominal capacitance(pf) frequency 10.1mhz voltage 0.5 to 5vrms adhesive strength of termination no removal of the terminations or other defect should occur. solder the capacitor to the test jig (glass epoxy board) shown in fig.1a using a eutectic solder. then apply 5n* force in parallel with the test jig for 101sec. *2n(gjm03) vibration resistance appearance: no defects or abnormalities. capacitance: within the specified tolerance. 30pfmin.: q r 1000 30pfmax.: q r 400+20c c: nominal capacitance(pf) the frequency range, from 10 to 55hz and return to 10hz, should be traversed in approximately 1 minute. this motion should be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours). deflection no crack or marked defect should occur. flexure:1mm solderability of termination 75% of the terminations are to be soldered evenly and continuously. immerse in eutectic solder solution for 20.5 seconds at 2305c or sn-3.0ag-0.5cu solder solution for 20.5 seconds at 2455c . resistance to soldering heat appearance: no marking defects. capacitance change: within 2.5% or 0.25 pf (whichever is larger) 30pfmin.: q r 1000 30pfmax.: q r 400+20c c: nominal capacitance(pf) immerse the capacitor in a eutectic solder solution or sn-3.0 ag?0.5cu solder solution at 2705c for 100.5 seconds. let sit at room temperature for 242 hours. temperature cycle appearance: no marking defects. capacitance change: within 2.5% or 0.25 pf (whichever is larger) 30pfmin.: q r 1000 30pfmax.: q r 400+20c c: nominal capacitance (pf) 55c to 125c five cycles humidity steady state appearance: no marking defects. capacitance change: within 5% or 0.5pf (whichever is larger) 30pf and over: q r 350 10pf and over, 30pf and below: q r 275+5c/2 10pf and below: q r 200+10c yyy c: nominal capacitance (pf) 402c and 90 to 95% humiduty for 50012 hours. humidity load appearance: no marking defects. capacitance change: within 7.5% or 0.75pf (whichever is larger) 30pf and over: q r 200 30pf and below: q r 100+10/3c c: nominal capacitance(pf) apply the rated voltage at 402c and 90 to 95% humidity for 50012 hours. high temperature load appearance: no marking defects. capacitance change: within 3% or 0.3pf (whichever is larger) 30pf and over: q r 350 10pf and over, 30pf and below: q r 275+5c/2 10pf and below: q r 200+10c c: nominal capacitance(pf) apply 200% of the rated voltage for 100012 hours at the maximun operating temperature 3c. let sit for 242 hours (temperature compensating type) at room temperature, then measure.the charge/discharge current is less than 50ma the capacita n ce cha n ge sh o u ld be m ea su r ed afte r 5 m i n. at eac h s pecified te m pe r at u r e stage. t h e temperat u r e coe f ficie n t i s dete rm i n ed us i n g the capacitance m ea su r ed i n step 3 a s a r efe r e n ce . wh en c y cli n g t h e te m pe r at u r e s eq u e n tiall y f r o m s tep 1 th r o u g h 5 t h e capacita n ce sh o u ld be w it h in t h e s pecified tole r a n ce fo r the te m perat u r e coe f ficie n t a n d capacitance c h a n ge a s i n t able a -1 . t h e capacita n ce drift i s calc u lated b y di v idi n g t h e di f fe r e n ce s bet w ee n the m axi mu m a n d m i n i m u m m ea su r ed v alue s in s tep s 1, 3 a n d 5 by t h e cap . v alue in s tep 3 . t e m per atu r e coef ficen t: w ith i n t h e specified toleran ce. ( t able a- 1 ) capacitan ce chan ge: within 0.2 % or 0 .05 p f ( which ever is lar ger ) capacitance temperature characteristics step temperature ( o c ) 1 25 p 2 2 -55 p3 3 25 p 2 4 125 p 3 5 25 p 2 g j m series applica tion specific cap a citor s high frequency ceramic capacitors gjm specifications and test methods innovator in electronics C 11 c-29-c www.murata.com table a-1 capacitance change from 25c % ? 55 30 ?10 nominal v alues char. (ppm/c ) note ma x . min . ma x . min . ma x . min . 0 30 5 c 0.58 -0.24 0.40 -0.17 0.25 -0.11 0 60 6c 0.87 -0.48 0.60 -0.33 0.38 -0.21 note nominal values denote the temperature coefficient within a range of 25c to 125c. specifications and test methods gjm series item specifications test methods humidity load appearance: no marking defects. capacitance change: within 7.5% or 0.75pf (whichever is larger) 30pf and over: q r 200 30pf and below: q r 100+10c/3 c: nominal capacitance(pf) apply the rated voltage at 402c and 90 to 95% humidity for 50012 hours. high temperature load appearance: no marking defects. capacitance change: within 3% or 0.3pf (whichever is larger) 30pf and over: q r 350 10pf and over, 30pf and below: q r 275+5c/2 10pf and below: q r 200+10c c: nominal capacitance(pf) apply 200% of the rated voltage for 100012 hours at the maximun operating temperature 3c. let sit for 242 hours (temperature compensating type) at room temperature, then measure.the charge/discharge current is less than 50ma esr 0.1pfc1pf: 350m? ? pf below 1pf innovator in electronics C 13 c-29-c www.murata.com esr - fr e quency characteristics 0 . 0 1 0 . 1 1 1 0 e s r ( oh m ) 1pf 10pf 20pf techn i c a l data (typ ical) 0 . 0 1 0 . 1 1 1 0 100 1000 10000 f r e q u e n c y m h i es r ( o h m ) 1pf 6 . 8pf 20pf 1 00m 1 g 1 0 g gjm03 s erie s measu r em en t equip m ent 8753d (agi l e nt ) gjm15 s erie s 1 00m 1 g 1 0 g esr ? frequency characteristics frequency (hz) frequency (hz) esr - frequency characteristics g j m series applica tion specific cap a citor s high frequency ceramic capacitors gjm technical data (typical) 14 C innovator in electronics c-29-c www.murata.com q - freq u ency characteristics 1 1 0 1 0 0 1 0 0 0 1 0 0 0 0 q 1pf 10p f 20p f 100m 1 g 10g 1 1 0 100 1000 10000 q 1pf 6 . 8pf 20p f 1 0 0 m 1 g 1 0 g frequency (hz) gjm03 s erie s measu r em en t equip m ent 8753d (agi l e nt ) gjm15 s erie s techn i c a l data (typ ical) frequency (hz) q - frequency characteristics g j m series applica tion specific cap a citor s high frequency ceramic capacitors gjm technical data (typical) innovator in electronics C 15 c-29-c www.murata.com choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. 1. mounting position locate chip horizontal to the direction in which stress acts chip arrangement worst a-c-(b~d) best component direction chip mounting close to board separation point a b d c perforation slit continued on the following page. 2. chip placing an excessively low bottom dead point of the suction nozzle imposes great force on the chip during mounting, causing cracked chips. so adjust the suction nozzle's bottom dead point by correcting warp in the board. normally, the suction nozzle's bottom dead point must be set on the upper surface of the board. nozzle pressure for chip mounting must be a 1 to 3n static load. dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall p revent the nozzle from moving smoothly. this imposes great force on the chip during mounting, causing cracked chips. and the locating claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips. the suction nozzle and the locating claw must be maintained, checked and replaced periodically. board guide correct suction nozzle board support pin incorrect deflection !caution (soldering and mounting) !caution 13 !note ? please read rating and !caution (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. ? t h i s c a t a l o g h a s o n l y t y p i c a l s p e c i f i c a t i o n s b e c a u s e t h e r e i s n o s p a c e f o r d e t a i l e d s p e c i f i c a t i o n s . t h e r e f o r e , p l e a s e a p p r o v e o u r p r o d u c t s p e c i f i c a t i o n s o r t r a n s a c t t h e a p p r o v a l s h e e t f o r p r o d u c t s p e c i f i c a t i o n s b e f o r e o r d e r i n g . 83 ? this pdf catalog is downloaded from the website of murata manufacturing co., ltd. therefore, it?s specifications are subject to change or our products in it may be discontinued without advance notice. please check with our sales representatives or product engineers before ordering. ? this pdf catalog has only typical specifications because there is no space for detailed specifications. therefore, please app rove our product specifications or transact the approval sheet for product specifications before ordering. !note c02e.pdf 07.2.6 g j m series applica tion specific cap a citor s high frequency ceramic capacitors gjm soldering and mounting 16 C innovator in electronics c-29-c www.murata.com g j m series applica tion specific cap a citor s high frequency ceramic capacitors gjm soldering and mounting 3. reflow soldering when sudden heat is applied to the components, the mechanical strength of the components should go down because remarkable temperature change causes deformity inside components. in order to prevent mechanical damage in the components, preheating should be required for both of the components and the pcb boar d. preheating conditions are shown in t able 1. it is required to keep temperature differential between the soldering and the components surfac e ( $t) as small as possible. solderability of tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the tin melting point is used. please confirm the solderability of tin plating termination chip before use. when components are immersed in solvent after mountin g, be sure to maintain the temperature difference ( $t) between the component and solvent within the range shown in the t able 1. grm02/03/15/18/21/31 gjm03/15 lll15/18/21/31 erb18/21 gqm18/21 grm32/43/55 lla18/21/31 llm21/31 gnm erb32 $t -190 % $t -130 % part number temperature differential table 1 recommended conditions standard conditions for reflow soldering allowable soldering temperature and time in case of repeated soldering, the accumulated soldering time must be within the range shown above. soldering time (sec.) 260 270 280 250 240 230 220 0 30 60 90 120 so l de r i ng te m p e r a t ur e ( %) inverting the pcb make sure not to impose an abnormal mechanical shock on the pcb. continued from the preceding page. continued on the following page. peak temperature atmosphere pb-sn solder infrared reflow 230-250 oc air vapor reflow 230-240 oc air lead free solder 240-260 oc air or n 2 infrared reflow vapor reflow 60-120 seconds 30-60 seconds $t gradual cooling soldering preheating 200 oc 170 oc 150 oc 130 oc time temperature ( %) peak temperature 60-120 seconds 20 seconds max. $t gradual cooling soldering preheating 170 oc 150 oc 130 oc time temperature ( %) peak temperature pb-sn solder: sn-37pb lead free solder: sn-3.0ag-0.5cu optimum solder amount for reflow soldering overly thick application of solder paste results in excessive fillet height solder. this makes the chip more susceptible to mechanical and thermal stress on the board and may cause cracked chips. too little solder paste results in a lack of adhesive strength on the outer electrode, which may result in chips breaking loose from the pcb. make sure the solder has been applied sm oothly to the end surface to a height of 0.2mm min. optimum solder amount for reflow soldering 0.2mm min. caution 13 note ? please read rating and caution (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. ? t h i s c a t a l o g h a s o n l y t y p i c a l s p e c i f i c a t i o n s b e c a u s e t h e r e i s n o s p a c e f o r d e t a i l e d s p e c i f i c a t i o n s . t h e r e f o r e , p l e a s e a p p r o v e o u r p r o d u c t s p e c i f i c a t i o n s o r t r a n s a c t t h e a p p r o v a l s h e e t f o r p r o d u c t s p e c i f i c a t i o n s b e f o r e o r d e r i n g . 8 4 ? this pdf catalog is downloaded from the website of murata man ufacturing co., ltd. therefore, its specifications are subject to change or our products in it may be discontinued without advance notice. please check with our sales representatives or product engineers before ordering. ? this pdf catalog has only typical specifications because ther e is no space for detailed specifications. therefore, please app rove our product specifications or transact the approval sheet for product specifications before ordering. note c02e.pdf 07.2.6 gjm03/15 reflow soldering when sudden heat is applied to the components, the mechanical strength of the components should go down because remarkable temperature change causes deformity inside components. in order to prevent mechanical damage in the components, preheating should be required for both of the components and the pcb boar d. preheating conditions are shown in t able 1 . it is required to keep temperature differential between the soldering and the components surface ( $t) as small as possible. solderability of tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the tin melting point is used. please confirm the solderability of tin plating termination chip before use. when components are immersed in solvent after mountin g, be sure to maintain the temperature difference ( $t) between the component and solvent within the range shown in the t able 1. grm02/03/1 5/18/21/31 gjm03/15 erb18/21 gqm18/21 grm32/43/55 gnm erb32 $t -190 % $t -130 % part number temperature differential table 1 recommended conditions standard conditions for reflow soldering allowable soldering temperature and time in case of repeated soldering, the accumulated soldering time must be within the range shown above. soldering time (sec.) 260 270 280 250 240 230 220 0 30 60 90 120 so l de r i ng te m p e r a t ur e ( %) inverting the pcb make sure not to impose an abnormal mechanical shock on the pcb. continued on the following page. peak temperature atmosphere pb-sn solder infrared reflow 230-250 oc air vapor reflow 230-240 oc air lead free solder 240-260 oc air or n 2 infrared reflow vapor reflow 60-120 seconds 30-60 seconds $t gradual cooling soldering preheating 200 oc 170 oc 150 oc 130 oc time temperature ( %) peak temperature 60-120 seconds 20 seconds max. $t gradual cooling soldering preheating 170 oc 150 oc 130 oc time temperature ( %) peak temperature pb-sn solder: sn-37pb lead free solder: sn-3.0ag-0.5cu optimum solder amount for reflow soldering overly thick application of solder paste results in excessive fillet height solder. this makes the chip more susceptible to mechanical and thermal stress on the board and may cause cracked chips. too little solder paste results in a lack of adhesive strength on the outer electrode, which may result in chips breaking loose from the pcb. make sure the solder has been applied sm oothly to the end surface to a height of 0.2mm min. optimum solder amount for reflow soldering 0.2mm min. reflow soldering when sudden heat is applied to the components, the mechanical strength of the components should go down because remarkable temperature change causes deformity inside components. in order to prevent mechanical damage in the components, preheating should be required for both of the components and the pcb boar d. preheating conditions are shown in t able 1 . it is required to keep temperature differential between the soldering and the components surface ( $t) as small as possible. solderability of tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the tin melting point is used. please confirm the solderability of tin plating termination chip before use. when components are immersed in solvent after mountin g, be sure to maintain the temperature difference ( $t) between the component and solvent within the range shown in the t able 1. grm02/03/1 5/18/21/31 gjm03/15 erb18/21 gqm18/21 grm32/43/55 gnm erb32 $t -190 % $t -130 % part number temperature differential table 1 recommended conditions standard conditions for reflow soldering allowable soldering temperature and time in case of repeated soldering, the accumulated soldering time must be within the range shown above. soldering time (sec.) 260 270 280 250 240 230 220 0 30 60 90 120 so l de r i ng te m p e r a t ur e ( %) inverting the pcb make sure not to impose an abnormal mechanical shock on the pcb. continued on the following page. peak temperature atmosphere pb-sn solder infrared reflow 230-250 oc air vapor reflow 230-240 oc air lead free solder 240-260 oc air or n 2 infrared reflow vapor reflow 60-120 seconds 30-60 seconds $t gradual cooling soldering preheating 200 oc 170 oc 150 oc 130 oc time temperature ( %) peak temperature 60-120 seconds 20 seconds max. $t gradual cooling soldering preheating 170 oc 150 oc 130 oc time temperature ( %) peak temperature pb-sn solder: sn-37pb lead free solder: sn-3.0ag-0.5cu optimum solder amount for reflow soldering overly thick application of solder paste results in excessive fillet height solder. this makes the chip more susceptible to mechanical and thermal stress on the board and may cause cracked chips. too little solder paste results in a lack of adhesive strength on the outer electrode, which may result in chips breaking loose from the pcb. make sure the solder has been applied sm oothly to the end surface to a height of 0.2mm min. optimum solder amount for reflow soldering 0.2mm min. innovator in electronics C 17 c-29-c www.murata.com g j m series applica tion specific cap a citor s high frequency ceramic capacitors gjm soldering and mounting solder amount correction with a soldering iron (1) for chip type capacitors gjm03/15 part number $t -190 % table 2 washing excessive output of ultrasonic oscillation during cleaning causes pcbs to resonate, resulting in cracked chips or broken solder. take note not to vibrate pcbs. failure to follow the above cautions may result, worst case, in a short circuit and fuming when the product is used. 150 oc min. preheating temperature air atmosphere *applicable for both pb-sn and lead free solder. pb-sn solder: sn-37pb lead free solder: sn-3.0ag-0.5cu caution 86 13 in section temperature of soldering iron tip t emperature differential $ t 350c max. optimum solder amount when corrections are made using a soldering lron the top of the solder fillet should be lower than the thickness of components. if the solder amount is excessively big, the risk of cracking is higher during board bending or under any other stressful conditions. soldering iron ?3mm or smaller should be required. and it is necessary to keep a distance between the soldering iron and the components without direct touch. thread solder with ?0.5mm or smaller is required for soldering. up to chip thickness correction with a soldering iron (1) for chip type capacitors when sudden heat is applied to the components by soldering iron, the mechanical strength of the components should go down because remarkable temperature change causes deformity inside component s. in order to prevent mechanical damage in the components, preheating should be required for both of the components and the pcb board. preheating conditions are shown in t able 3. it is required to keep temperature dif ferential between the soldering and the components surface ( $t) as small as possible. after soldering, it is not allowed to cool it down rapidly. grm15/18/21/31 gjm15 gqm18/21 erb18/21 grm32/43/55 gnm erb32 $t -190 % $t -130 % part number temperature differential table 3 continued from the preceding page. washing excessive output of ultrasonic oscillation during cleaning causes pcbs to resonate, resulting in cracked chips or broken solder. take note not to vibrate pcbs. failure to follow the above cautions may result, worst case, in a short circuit and/or fuming when the product is used. 300 oc max. 3 seconds max. / termination 270 oc max. 3 seconds max. / termination peak temperature air air atmosphere applicable for both pb-sn and lead free solder. pb-sn solder: sn-37pb lead free solder: sn-3.0ag-0.5cu caution 86 13 18 C innovator in electronics c-29-c www.murata.com g j m series applica tion specific cap a citor s high frequency ceramic capacitors gjm design engineering kits 6 g-06-f design engineering kits general ceramic chip capacitors 0201 (6.3 to 25 vdc ) n better q and low esr at vhf, uhf and microwave frequencies . n 0201 size with copper inner electrode. n tight tolerance available. [w] = +/-0.05pf for 5pf & under [b] = +/-0.1pf for under 10pf [c] = +/-0.25pf for under 10p f [f] = +/-1% for 10pf & over [g] = +/-2% for 10pf & ove r n low power consumption, yield ratio improvement due to the better q or lower esr. n gjm series is suited to vco or pa module applications . n gjm series is offered with a ni barrier termination plated with matte tin (sn), and is rohs compliant. no. descriptio nm urata global p/ nq ty. 1 0201/c0g/0.20pf/25v gjm0335c1er20bb01 20 2 0201/c0g/0.30pf/25v gjm0335c1er30bb01 20 3 0201/c0g/0.40pf/25v gjm0335c1er40bb01 20 4 0201/c0g/0.50pf/25v gjm0335c1er50bb01 20 5 0201/c0g/0.60pf/25v gjm0335c1er60bb01 20 6 0201/c0g/0.70pf/25v gjm0335c1er70bb01 20 7 0201/c0g/0.80pf/25v gjm0335c1er80bb01 20 8 0201/c0g/0.90pf/25v gjm0335c1er90bb01 20 9 0201/c0g/1.0pf/25v gjm0335c1e1r0cb01 20 10 0201/c0g/1.1pf/25v gjm0335c1e1r1cb01 20 11 0201/c0g/1.2pf/25v gjm0335c1e1r2cb01 20 12 0201/c0g/1.3pf/25v gjm0335c1e1r3cb01 20 13 0201/c0g/1.5pf/25v gjm0335c1e1r5cb01 20 14 0201/c0g/1.6pf/25v gjm0335c1e1r6cb01 20 15 0201/c0g/1.8pf/25v gjm0335c1e1r8cb01 20 16 0201/c0g/2.0pf/25v gjm0335c1e2r0cb01 20 17 0201/c0g/2.2pf/25v gjm0335c1e2r2cb01 20 18 0201/c0g/2.4pf/25v gjm0335c1e2r4cb01 20 19 0201/c0g/2.7pf/25v gjm0335c1e2r7cb01 20 20 0201/c0g/3.0pf/25v gjm0335c1e3r0cb01 20 21 0201/c0g/3.3pf/25v gjm0335c1e3r3cb01 20 22 0201/c0g/3.6pf/25v gjm0335c1e3r6cb01 20 23 0201/c0g/3.9pf/25v gjm0335c1e3r9cb01 20 24 0201/c0g/4.0pf/25v gjm0335c1e4r0cb01 20 25 0201/c0g/4.3pf/25v gjm0335c1e4r3cb01 20 26 0201/c0g/4.7pf/25v gjm0335c1e4r7cb01 20 27 0201/c0g/5.0pf/25v gjm0335c1e5r0cb01 20 28 0201/c0g/5.1pf/25v gjm0335c1e5r1db01 20 29 0201/c0g/5.6pf/25v gjm0335c1e5r6db01 20 30 0201/c0g/6.0pf/25v gjm0335c1e6r0db01 20 31 0201/c0g/6.2pf/25v gjm0335c1e6r2db01 20 32 0201/c0g/6.8pf/25v gjm0335c1e6r8db01 20 33 0201/c0h/7.0pf/25v gjm0336c1e7r0db01 20 34 0201/c0h/7.5pf/25v gjm0336c1e7r5db01 20 35 0201/c0h/8.0pf/25v gjm0336c1e8r0db01 20 36 0201/c0h/8.2pf/25v gjm0336c1e8r2db01 20 37 0201/c0h/9.0pf/25v gjm0336c1e9r0db01 20 38 0201/c0h/9.1pf/25v gjm0336c1e9r1db01 20 39 0201/c0h/10pf/25v gjm0336c1e100jb01 20 40 0201/c0h/12pf/25v gjm0336c1e120jb01 20 41 0201/c0h/15pf/25v gjm0336c1e150jb01 20 42 0201/c0h/18pf/25v gjm0336c1e180jb01 20 43 0201/c0h/20pf/25v gjm0336c1e200jb01 20 44 0201/c0g/22pf/6.3v gjm0335c0j220jb01 20 45 0201/c0g/27pf/6.3v gjm0335c0j270jb01 20 46 0201/c0g/33pf/6.3v gjm0335c0j330jb01 20 gjm03-kit ????????e (standard tolerance) no. descriptio nm urata global p/n qty. 1 0201/c0g/0.20pf/25v gjm0335c1er20wb01 20 2 0201/c0g/0.30pf/25v gjm0335c1er30wb01 20 3 0201/c0g/0.40pf/25v gjm0335c1er40wb01 20 4 0201/c0g/0.50pf/25v gjm0335c1er50wb01 20 5 0201/c0g/0.60pf/25v gjm0335c1er60wb01 20 6 0201/c0g/0.70pf/25v gjm0335c1er70wb01 20 7 0201/c0g/0.80pf/25v gjm0335c1er80wb01 20 8 0201/c0g/0.90pf/25v gjm0335c1er90wb01 20 9 0201/c0g/1.0pf/25v gjm0335c1e1r0bb01 20 10 0201/c0g/1.1pf/25v gjm0335c1e1r1bb01 20 11 0201/c0g/1.2pf/25v gjm0335c1e1r2bb01 20 12 0201/c0g/1.3pf/25v gjm0335c1e1r3bb01 20 13 0201/c0g/1.5pf/25v gjm0335c1e1r5bb01 20 14 0201/c0g/1.6pf/25v gjm0335c1e1r6bb01 20 15 0201/c0g/1.8pf/25v gjm0335c1e1r8bb01 20 16 0201/c0g/2.0pf/25v gjm0335c1e2r0bb01 20 17 0201/c0g/2.2pf/25v gjm0335c1e2r2bb01 20 18 0201/c0g/2.4pf/25v gjm0335c1e2r4bb01 20 19 0201/c0g/2.7pf/25v gjm0335c1e2r7bb01 20 20 0201/c0g/3.0pf/25v gjm0335c1e3r0bb01 20 21 0201/c0g/3.3pf/25v gjm0335c1e3r3bb01 20 22 0201/c0g/3.6pf/25v gjm0335c1e3r6bb01 20 23 0201/c0g/3.9pf/25v gjm0335c1e3r9bb01 20 24 0201/c0g/4.0pf/25v gjm0335c1e4r0bb01 20 25 0201/c0g/4.3pf/25v gjm0335c1e4r3bb01 20 26 0201/c0g/4.7pf/25v gjm0335c1e4r7bb01 20 27 0201/c0g/5.0pf/25v gjm0335c1e5r0bb01 20 28 0201/c0g/5.1pf/25v gjm0335c1e5r1cb01 20 29 0201/c0g/5.6pf/25v gjm0335c1e5r6cb01 20 30 0201/c0g/6.0pf/25v gjm0335c1e6r0cb01 20 31 0201/c0g/6.2pf/25v gjm0335c1e6r2cb01 20 32 0201/c0g/6.8pf/25v gjm0335c1e6r8cb01 20 33 0201/c0h/7.0pf/25v gjm0336c1e7r0cb01 20 34 0201/c0h/7.5pf/25v gjm0336c1e7r5cb01 20 35 0201/c0h/8.0pf/25v gjm0336c1e8r0cb01 20 36 0201/c0h/8.2pf/25v gjm0336c1e8r2cb01 20 37 0201/c0h/9.0pf/25v gjm0336c1e9r0cb01 20 38 0201/c0h/9.1pf/25v gjm0336c1e9r1cb01 20 39 0201/c0h/10pf/25v gjm0336c1e100gb01 20 40 0201/c0h/12pf/25v gjm0336c1e120gb01 20 41 0201/c0h/15pf/25v gjm0336c1e150gb01 20 42 0201/c0h/18pf/25v gjm0336c1e180gb01 20 43 0201/c0h/20pf/25v gjm0336c1e200gb01 20 44 0201/c0g/22pf/6.3v gjm0335c0j220gb01 20 45 0201/c0g/27pf/6.3v gjm0335c0j270gb01 20 46 0201/c0g/33pf/6.3v gjm0335c0j330gb01 20 gjm03-kit- ttol???e (tight tolerance) note: for ceramic chip capacitors, dashes are part of the part number and must be included when placing an order. innovator in electronics C 19 c-29-c www.murata.com g j m series applica tion specific cap a citor s high frequency ceramic capacitors gjm design engineering kits g-06-f 7 design engineering kits general ceramic chip capacitors 0402 (50 vdc ) n better q and low esr at vhf, uhf and microwave frequencies . n 0402 size with copper inner electrode. n tight tolerance available. [w] = +/-0.05pf for 5pf & under [b] = +/-0.1pf for under 10p f [c] = +/-0.25pf for under 10pf [f] = +/-1% for 10pf & over [g] = +/-2% for 10pf & over n low power consumption, yield ratio improvement due to the better q or lower esr. n gjm series is suited to vco or pa module applications . n gjm series is offered with a ni barrier termination plated with matte tin (sn), and is rohs compliant. no. descriptio nm urata global p/ nq ty. 1 0402/c0g/0.10pf/50v gjm1555c1hr10bb01 20 2 0402/c0g/0.20pf/50v gjm1555c1hr20bb01 20 3 0402/c0g/0.30pf/50v gjm1555c1hr30bb01 20 4 0402/c0g/0.40pf/50v gjm1555c1hr40bb01 20 5 0402/c0g/0.50pf/50v gjm1555c1hr50bb01 20 6 0402/c0g/0.60pf/50v gjm1555c1hr60bb01 20 7 0402/c0g/0.70pf/50v gjm1555c1hr70bb01 20 8 0402/c0g/0.80pf/50v gjm1555c1hr80bb01 20 9 0402/c0g/0.90pf/50v gjm1555c1hr90bb01 20 10 0402/c0g/1.0pf/50v gjm1555c1h1r0cb01 20 11 0402/c0g/1.1pf/50v gjm1555c1h1r1cb01 20 12 0402/c0g/1.2pf/50v gjm1555c1h1r2cb01 20 13 0402/c0g/1.3pf/50v gjm1555c1h1r3cb01 20 14 0402/c0g/1.5pf/50v gjm1555c1h1r5cb01 20 15 0402/c0g/1.6pf/50v gjm1555c1h1r6cb01 20 16 0402/c0g/1.8pf/50v gjm1555c1h1r8cb01 20 17 0402/c0g/2.0pf/50v gjm1555c1h2r0cb01 20 18 0402/c0g/2.2pf/50v gjm1555c1h2r2cb01 20 19 0402/c0g/2.4pf/50v gjm1555c1h2r4cb01 20 20 0402/c0g/2.7pf/50v gjm1555c1h2r7cb01 20 21 0402/c0g/3.0pf/50v gjm1555c1h3r0cb01 20 22 0402/c0g/3.3pf/50v gjm1555c1h3r3cb01 20 23 0402/c0g/3.6pf/50v gjm1555c1h3r6cb01 20 24 0402/c0g/3.9pf/50v gjm1555c1h3r9cb01 20 25 0402/c0g/4.0pf/50v gjm1555c1h4r0cb01 20 26 0402/c0g/4.3pf/50v gjm1555c1h4r3cb01 20 27 0402/c0g/4.7pf/50v gjm1555c1h4r7cb01 20 28 0402/c0g/5.0pf/50v gjm1555c1h5r0cb01 20 29 0402/c0g/5.1pf/50v gjm1555c1h5r1db01 20 30 0402/c0g/5.6pf/50v gjm1555c1h5r6db01 20 31 0402/c0g/6.0pf/50v gjm1555c1h6r0db01 20 32 0402/c0g/6.2pf/50v gjm1555c1h6r2db01 20 33 0402/c0g/6.8pf/50v gjm1555c1h6r8db01 20 34 0402/c0g/7.0pf/50v gjm1555c1h7r0db01 20 35 0402/c0g/7.5pf/50v gjm1555c1h7r5db01 20 36 0402/c0g/8.0pf/50v gjm1555c1h8r0db01 20 37 0402/c0g/8.2pf/50v gjm1555c1h8r2db01 20 38 0402/c0g/9.0pf/50v gjm1555c1h9r0db01 20 39 0402/c0g/9.1pf/50v gjm1555c1h9r1db01 20 40 0402/c0g/10pf/50v gjm1555c1h100jb01 20 41 0402/c0g/12pf/50v gjm1555c1h120jb01 20 42 0402/c0g/15pf/50v gjm1555c1h150jb01 20 43 0402/c0g/18pf/50v gjm1555c1h180jb01 20 44 0402/c0g/20pf/50v gjm1555c1h200jb01 20 gjm15-kit ????????e (standard tolerance) no. descriptio nm urata global p/n qty. 1 0402/c0g/0.10pf/50v gjm1555c1hr10wb01 20 2 0402/c0g/0.20pf/50v gjm1555c1hr20wb01 20 3 0402/c0g/0.30pf/50v gjm1555c1hr30wb01 20 4 0402/c0g/0.40pf/50v gjm1555c1hr40wb01 20 5 0402/c0g/0.50pf/50v gjm1555c1hr50wb01 20 6 0402/c0g/0.60pf/50v gjm1555c1hr60wb01 20 7 0402/c0g/0.70pf/50v gjm1555c1hr70wb01 20 8 0402/c0g/0.80pf/50v gjm1555c1hr80wb01 20 9 0402/c0g/0.90pf/50v gjm1555c1hr90wb01 20 10 0402/c0g/1.0pf/50v gjm1555c1h1r0bb01 20 11 0402/c0g/1.1pf/50v gjm1555c1h1r1bb01 20 12 0402/c0g/1.2pf/50v gjm1555c1h1r2bb01 20 13 0402/c0g/1.3pf/50v gjm1555c1h1r3bb01 20 14 0402/c0g/1.5pf/50v gjm1555c1h1r5bb01 20 15 0402/c0g/1.6pf/50v gjm1555c1h1r6bb01 20 16 0402/c0g/1.8pf/50v gjm1555c1h1r8bb01 20 17 0402/c0g/2.0pf/50v gjm1555c1h2r0bb01 20 18 0402/c0g/2.2pf/50v gjm1555c1h2r2bb01 20 19 0402/c0g/2.4pf/50v gjm1555c1h2r4bb01 20 20 0402/c0g/2.7pf/50v gjm1555c1h2r7bb01 20 21 0402/c0g/3.0pf/50v gjm1555c1h3r0bb01 20 22 0402/c0g/3.3pf/50v gjm1555c1h3r3bb01 20 23 0402/c0g/3.6pf/50v gjm1555c1h3r6bb01 20 24 0402/c0g/3.9pf/50v gjm1555c1h3r9bb01 20 25 0402/c0g/4.0pf/50v gjm1555c1h4r0bb01 20 26 0402/c0g/4.3pf/50v gjm1555c1h4r3bb01 20 27 0402/c0g/4.7pf/50v gjm1555c1h4r7bb01 20 28 0402/c0g/5.0pf/50v gjm1555c1h5r0bb01 20 29 0402/c0g/5.1pf/50v gjm1555c1h5r1cb01 20 30 0402/c0g/5.6pf/50v gjm1555c1h5r6cb01 20 31 0402/c0g/6.0pf/50v gjm1555c1h6r0cb01 20 32 0402/c0g/6.2pf/50v gjm1555c1h6r2cb01 20 33 0402/c0g/6.8pf/50v gjm1555c1h6r8cb01 20 34 0402/c0g/7.0pf/50v gjm1555c1h7r0cb01 20 35 0402/c0g/7.5pf/50v gjm1555c1h7r5cb01 20 36 0402/c0g/8.0pf/50v gjm1555c1h8r0cb01 20 37 0402/c0g/8.2pf/50v gjm1555c1h8r2cb01 20 38 0402/c0g/9.0pf/50v gjm1555c1h9r0cb01 20 39 0402/c0g/9.1pf/50v gjm1555c1h9r1cb01 20 40 0402/c0g/10pf/50v gjm1555c1h100gb01 20 41 0402/c0g/12pf/50v gjm1555c1h120gb01 20 42 0402/c0g/15pf/50v gjm1555c1h150gb01 20 43 0402/c0g/18pf/50v gjm1555c1h180gb01 20 44 0402/c0g/20pf/50v gjm1555c1h200gb01 20 gjm15-kit- ttol???e (tight tolerance) note: for ceramic chip capacitors, dashes are part of the part number and must be included when placing an order. |
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